CALL FOR PAPERS|embedded world China Conference 2024

embedded world China Conference 2024


Exhibition Info

Exhibition Date:

June 12-14, 2024

Opening Hours:

June 12 9:00 - 17:00

June 13 9:00 - 17:00    

June 14 9:00 - 16:00 


H3, SWEECC (No. 1099, Guozhan Rd. Pudong, Shanghai)


16,000 sqm, 300 exhibitors



The first appearance of embedded world China Conference in June, 2023 was a success. From the beginning of the preparation, the conference has insisted on "content driven", "transferring the core knowledge of embedded industry" as the key spirit, and is committed to creating a high-quality communication platform for embedded system industry developers, engineers, technicians, etc. Hereby, a professional Program Committee was organized, the members are experts, professors, and corporate top-management from domestic and overseas authoritative institutions, as well as leading enterprises, which provides professional guidance and selection of content, so as to ensure the conference quality.

(Click to review embedded world China 2023)

Following this core value, all contributions for the conference in 2024 would still be from call-for-papers, which has provided equal participation opportunities for everyone who has their own viewpoints and insights in the embedded system industry. Whether it's the academic discussion on the depth of expertise or the case study of daily R&D applications, all of them can be seen by the advisory board of experts through the cfp platform and have the opportunity to communicate with the audience as a speaker in the conference from 12 to 14 June, 2024.

embedded world China Conference 2024 now CALL FOR PAPERS! Please click here to begin your submission.

Topics of interest include, but are not limited


Internet of Things - Platforms & Applications

  Edge / Fog / Cloud Computing

  Cyber Physical Systems in Industrial IOT

  Data Management and Analytics

  Application Case Studies for IOT


Connectivity Solutions

 Wired Technologies (fieldbuses,   embedded connectivity)

  Wireless Technologies (LPWAN,…)

  Cellular Communication / NB-IoT / 5G / 6G

  ZigBee, Bluetooth

  Embedded Ethernet


Embedded OS

   Embedded RTOS (AutoSAR, FreeRTOS,…)

   Open Source / Embedded Linux / Android

   Embedded Virtualization, Separation and Hypervisors


Safety & Security

Safety and Security Standards

Safety and Security Architectures

Hardware Security

Cryptography and Hacking

Trusted Computing and Blockchain Technologies

Securing Embedded Communication


Board Level Hardware Engineering

Advanced Microcontroller Solutions, Multicore

Memory Technologies

Power Management, Low-Power Design

Free and Open Hardware

Supply Chain


Systems & Software Engineering

Development Processes, Methods and Tools

Programming Languages and Standards, MISRA

System and Software Architectures

Code Qualification, Static Code analysis, Testing

System and Software Quality


Embedded AI & Intelligent Systems

Hardware Solutions for Embedded AI

Software Frameworks and Libraries

Embedded Vision / Cameras

Sensor Systems, Integration & Fusion

Embedded AI and Applications

Autonomous & Intelligent Systems (cars,…)

AI Application Case Studies


Embedded Human-Machine-Interface

Usability and HMI Design

Embedded Graphic Libraries

Gesture and Voice Recognition

Augmented Reality


System-on-Chip (SoC) Design

Emerging complex IC and System solutions

FPGA and ASIC design

Free and Open Hardware (RISC-V,…)

Digital Design, Architectures and Solutions

Trusted Electronics & Secure Elements


Cross-Domain Topics and Application Use Cases for embedded Technologies

Open Source

High Performance Embedded Architectures

Embedded Solutions for Medical

Embedded Solutionsfor Automotive

This first staging of the conference was a complete success, as is also evidenced by the more than 100 submissions. As a result, there were 35 technology-oriented presentations, two keynote lectures by AMD and ARM, and a very lively panel discussion. All in all, an event of very high quality and professionalism.


-- Prof. Dr. -ing. Axel Sikora

Chairman, embedded world China Conference

Contributions will be selected based on the following criteria:
    - novelty
    - technological soundness
    - technological significance
    - ​experience of the speaker

No Promotion:
Promotional or marketing-oriented presentations or pure product descriptions will not be accepted.

Submissions to embedded world China Conference should not have been published previously in a journal or conference proceedings, nor presented at another conference, nor should it be currently under review or consideration for publication or presentation elsewhere.

The conference language is English and Chinese.

Progress of Submission:
Please click here to login, or create a new account.
1. Please enter the title and the topic of the abstract.
2. Enter your abstract text. The number of characters is limited to 1,500!!
3. Enter the author contact details - CV: The number of characters is limited to 500!!
4. Confirm your submission details and complete the process.

Important Deadlines:
Abstract submission: March 10, 2024
Conference Agenda Release: April 1, 2024
Final Paper: May 31, 2024

*The program committee will strictly respect your authorship and copyrights, the submitted papers will not be published, distributed or used in other channels without author's permission if the papers have not been accepted.

embedded world China

  • Date:2024.6.12-14
  • Opening hours:2024.6.12-13 9:00-17:00
    2024.6.14 9:00-16:00
  • Venue:Hall 3, Shanghai World Expo Exhibition & Convention Center
    (No. 1099, Guozhan Rd. Pudong New District, Shanghai, China)